[ad_1]
As part of the Future of Semiconductors (FuSe) initiative, the US National Science Foundation (NSF) has decided to financed with 50 million dollars a partnership between Ericsson, IBM, Intel and Samsung aimed at developing next generation chips. The US government agency and the four tech giants will work on multiple fronts to develop the components in various areas including performance, chip and system levels, recyclability, environmental impact and manufacturability.
According to NSF director Sethuraman Panchanathan, this partnership also aims to “encourage innovation, accelerate the translation of results to market and prepare the workforce for future research”.
In recent years, according to NSF, progress in the development of new processes, materials, devices, and architectures has been severely hampered by each company’s independent development. NSF believes that a holistic approach can accelerate the process of creating “high-performance, robust, safe, compact, energy-efficient and cost-effective solutions” for the technology sector.
Today’s announcement is just the latest from the NSF regarding the semiconductor workforce development strongly advocated by the Biden administration. which has provided funds of more than 280 billion dollars to strengthen US scientific and technological innovation. In recent months, in fact, have already been announced a partnership with the Semiconductor Research Corporation, a funding of 10 million dollars with Intel and a partnership of 10 million dollars with Micron Technology Inc.
[ad_2]
Source link
